Tháng Bảy 13, 2022

TUYỂN DỤNG: Signal Intergity/ Power Intergrity Engineer – Bình Dương – Hạn nộp hồ sơ 26/7/2022

CÔNG TY TNHH SV PROBE VIETNAM

Job Locations: Binh Duong | Ho Chi Minh | Bien Hoa

Negotiable

WHAT WE CAN OFFER

Thưởng tháng 13, thưởng thành tích

Bảo hiểm tai nạn 24/24; Bảo hiểm sức khỏe

Công ty có xe đưa đón từ Bình Thạnh

JOB DESCRIPTION

A. Job purpose:
In this role, you will be responsible for providing substrate/PCB/hi-speed probe head signal integrity and power integrity solutions for the probe card. You will be defining hi-speed probe head form factors, and optimizing substrate/PCB. You are required to architect substrates and PCB power integrity solutions such as voltage rail merging and isolation scheme, stack up and decoupling cap type and to provide design constraints for and guide implementation of component substrate, PCB and probe head to meet power noise targets.

B. Responsibilities and Duties:

You will work with a cross-functional team on challenging high-speed designs, solve problems and identify cost-effective solutions that do not sacrifice performance and meet specifications. Perform system-level/board-level channel simulations, implement, validate and correlate to simulations.
Design stack up considering trade-offs for manufacturing, performance, and cost. setup/Perform time/frequency domain measurements on passive interfaces and interface compliance measurements.
Document results. extract interconnect models based on simulation and measurements. Create equivalent circuit models of passive components.
Perform time/frequency domain power integrity simulations and validate using measurements. Work with cross-functional team to go through PCB Design process and Signoff on SIPI on all hardware designs.
Perform other job-related tasks as assigned by the management.

JOB REQUIREMENTS

1. Education, Professional:

Education: University graduated.
Must have a Bachelor of Engineer / Master of Science in Electrical Engineering or Electronics Engineering with 3+ years experience.

2. Competencies:

Strong electrical/electromagnetic fundamentals.
Strong Signal/Power Integrity fundamentals.
Strong knowledge of Power Delivery Network, impedance profile analysis, including low power methodologies; power delivery modeling, and complete system-level power delivery modeling.
Good substrate/PCB design knowledge and process awareness.
Good background in High-Speed System Interfaces like PCIe, USB3.0, etc.
Good knowledge of 3D/2D EM simulation tools like HFSS/Q3D/ADS/HSpice/PowerPC.
Good communication skills and very good team player.

Work Place: WFH or 06 street, Vietnam – Singapore Industrial Park, Thuan An City, Binh Duong Province